Method and apparatus for accessing data stored in a storage system that includes both a final level of cache and a main memory

ABSTRACT

A data access system including a processor and a storage system including a main memory and a cache module. The cache module includes a FLC controller and a cache. The cache is configured as a FLC to be accessed prior to accessing the main memory. The processor is coupled to levels of cache separate from the FLC. The processor generates, in response to data required by the processor not being in the levels of cache, a physical address corresponding to a physical location in the storage system. The FLC controller generates a virtual address based on the physical address. The virtual address corresponds to a physical location within the FLC or the main memory. The cache module causes, in response to the virtual address not corresponding to the physical location within the FLC, the data required by the processor to be retrieved from the main memory.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/137,611, filed on Apr. 25, 2016 (now U.S. Pat. No. 9,594,693) whichis a continuation of U.S. application Ser. No. 14/937,330, filed on Nov.10, 2015 (now U.S. Pat. No. 9,323,688) which is a continuation of U.S.application Ser. No. 14/710,988, filed on May 13, 2015 (now U.S. Pat.No. 9,182,915) which is a continuation of U.S. application Ser. No.14/519,826, filed on Oct. 21, 2014 (now U.S. Pat. No. 9,477,611) whichclaims the benefit of U.S. Provisional Application No. 61/893,662, filedon Oct. 21, 2013, U.S. Provisional Application No. 61/893,675, filed onOct. 21, 2013, and U.S. Provisional Application No. 61/893,683, filed onOct. 21, 2013, and U.S. Provisional Application No. 61/895,049, filedOct. 24, 2013. The entire disclosures of the applications referencedabove are incorporated herein by reference.

FIELD

The present disclosure relates to integrated circuits, and moreparticularly to cache associated with a system-on-chip.

BACKGROUND

The background description provided herein is for the purpose ofgenerally presenting the context of the disclosure. Work of thepresently named inventors, to the extent the work is described in thisbackground section, as well as aspects of the description that may nototherwise qualify as prior art at the time of filing, are neitherexpressly nor impliedly admitted as prior art against the presentdisclosure.

Devices such as computers, mobile phones, tablets, etc. typicallyinclude a system-on-chip (SoC). FIG. 1 shows an example of a device 10that includes a SoC 12 and one or more dynamic random access memories(DRAMs) 14. The DRAMs 14 can be implemented as one or more integratedcircuits that are connected to but separate from the SoC 12. The device10 can also include one or more storage drives 16 connected to ports 17of the SoC 12. The storage drives 16 can include flash memory,solid-state drives, hard disk drives, and/or hybrid drives. A hybriddrive includes a solid-state drive with solid-state memory and a harddisk drive with rotating storage media.

The SoC 12 can include one or more image processing devices 20, a systembus 22 and a memory controller 24. Each of the image processing devices20 can include, for example: a control module 26 with a centralprocessor (or central processing unit (CPU)) 28; a graphics processor(or graphics processing unit (GPU)) 30; a video recorder 32; a cameraimage signal processor (ISP) 34; an Ethernet interface such as a gigabit(Gb) Ethernet interface 36; a serial interface such as a universalserial bus (USB) interface 38 and a serial advanced technologyattachment (SATA) interface 40; and a peripheral component interconnectexpress (PCIe) interface 42. The image processing devices 20 access theDRAMs 14 via the system bus 22 and the memory controller 24. The DRAMs14 are used as main memory. For example, one of the image processingdevices 20 provides a physical address to the memory controller 24 whenaccessing a corresponding physical location in one of the DRAMs 14. Theimage processing devices 20 can also access the storage drives 16 viathe system bus 22.

The SoC 12 and/or the memory controller 24 can be connected to the DRAMs14 via one or more access ports 44 of the SoC 12. The DRAMs 14 storeuser data, system data, and/or programs. The SoC 12 can execute theprograms using first data to generate second data. The first data can bestored in the DRAMs 14 prior to the execution of the programs. The SoC12 can store the second data in the DRAMs 14 during and/or subsequent toexecution of the programs. The DRAMs 14 can have a high-bandwidthinterface and low-cost-per-bit memory storage capacity and can handle awide range of applications.

The SoC 12 includes cache memory, which can include one or more of alevel zero (L0) cache, a level one (L1) cache, a level two (L2) cache,or a level three (L3) cache. The L0-L3 caches are arranged on the SoC 12in close proximity to the corresponding ones of the image processingdevices 20. In the example shown, the control module 26 includes thecentral processor 28 and L1-L3 caches 50. The central processor 28includes a L0 cache 52. The central processor 28 also includes a memorymanagement unit (MMU) 54, which can control access to the caches 50, 52.

As the level of cache increases, the access latency and the storagecapacity of the cache increases. For example, L1 cache typically hasless storage capacity than L2 cache and L3 cache. However, L1 cachetypically has lower latency than L2 cache and L3 cache.

The caches within the SoC 12 are typically implemented as static randomaccess memories (SRAMs). Because of the close proximity of the caches tothe image processing devices 20, the caches can operate at the sameclock frequencies as the image processing devices 20. Thus cachesexhibit shorter latency periods than the DRAMS 14.

The number and size of the caches in the SoC 12 depends upon theapplication. For example, a handset (or mobile phone) may not include anL3 cache and can have smaller sized L1 cache and L2 cache than apersonal computer. Similarly, the number and size of each of the DRAMs14 depends on the application. For example, mobile phones currently have1-4 gigabytes (GB) of DRAM, personal computers currently have 4-16 GB ofDRAM, and servers currently have 32 GB-512 GB of DRAM. In general, costincreases as the amount of DRAM increases.

In addition to the cost of DRAM, it is becoming increasingly moredifficult to decrease the package size of DRAM for the same amount ofstorage capacity. Also, as the size and number of DRAMs incorporated ina device increases, the capacitances of the DRAMs increase, the numberand/or lengths of conductive elements associated with the DRAMsincrease, and buffering associated with the DRAMs increases. Inaddition, as the capacitances of the DRAMs increase, the operatingfrequencies of the DRAMs decrease and the latency periods of the DRAMsincrease.

During operation, programs and/or data are transferred from the DRAMs 14to the caches in the SoC 12 as needed. These transfers have higherlatency as compared to data exchanges between (i) the caches, and (ii)the corresponding processors and/or image processing devices. For thisreason, accesses to the DRAMs 14 are typically avoided due to the longerlatency periods.

During boot up, programs can be transferred from the storage drives 16to the DRAMs 14. For example, the central processor 28 can transferprograms from the storage drive 16 to the DRAMs 14 during the boot up.During the boot up, the central processor 28 can attempt to access datastored in the DRAMs 14. The percentage of hits associated with thisaccess attempt may initially be near or equal to 0%. However, thepercentage of hits approach 100% by the end of the boot up.

SUMMARY

A data access system is provided and includes a processor and a finallevel cache module. The processor is configured to generate a request toaccess a first physical address. The final level cache module includes adynamic random access memory (DRAM), a final level cache controller, anda DRAM controller. The final level cache controller is configured to (i)receive the request from the processor, and (ii) convert the firstphysical address to a first virtual address. The DRAM controller isconfigured to (i) convert the first virtual address to a second physicaladdress, and (ii) access the DRAM based on the second physical address.

A method for accessing a dynamic random access memory of a final levelcache module is provided. The method includes: generating, via aprocessor, a request to access a first physical address; receiving therequest from the processor at a final level cache controller; convertingthe first physical address to a first virtual address via the finallevel cache controller; converting the first virtual address to a secondphysical address via a dynamic random access memory controller; andaccessing the dynamic random access memory based on the second physicaladdress.

Further areas of applicability of the present disclosure will becomeapparent from the detailed description, the claims and the drawings. Thedetailed description and specific examples are intended for purposes ofillustration only and are not intended to limit the scope of thedisclosure.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a functional block diagram of a device according to the priorart.

FIG. 2 is a functional block diagram of a data access system inaccordance with an embodiment of the present disclosure.

FIG. 3 is a functional block diagram illustrating entries of a DRAM anda storage drive of the data access system of FIG. 2.

FIG. 4 illustrates a method of operating the data access system of FIG.2.

In the drawings, reference numbers may be reused to identify similarand/or identical elements.

DESCRIPTION

At least some of the following examples include final level cache (FLC)modules and storage drives. The FLC modules are used as virtual storageand the storage drives are used as physical storage. Data is first readfrom or written to the virtual storage prior to reading from or writingto the physical storage. Memory in the FLC modules and storage drives isreferred to herein as content addressable memory (CAM). Control modulesof the FLC modules control access to the memory in the FLC modules andthe storage drives using various CAM techniques described below. The CAMtechniques and other disclosed features reduce the required storagecapability of the DRAM in a device while maximizing memory access ratesand minimizing power consumption. The device may be a network device ora wireless network device. Examples of devices include but are notlimited to a computer, a mobile phone, a tablet, a camera, etc. The DRAMin the following examples is generally not used as main memory, butrather is used as virtual memory and/or as a final level of cache.

FIG. 2 shows a data access system 70 that includes image processingdevices 72, a system bus 74, a FLC module 76, and a storage drive 78.The data access system 70 may be implemented in, for example, acomputer, a mobile phone, a tablet, a server and/or other device. Theimage processing devices 72 may include, for example: a centralprocessor (or central processing unit (CPU)); a graphics processor (orgraphics processing unit (GPU)); a video recorder; a camera image signalprocessor (ISP); an Ethernet interface such as a gigabit (Gb) Ethernetinterface; a serial interface such as a universal serial bus (USB)interface and a serial advanced technology attachment (SATA) interface;and a peripheral component interconnect express (PCIe) interface; and/orother image processing devices. The image processing devices 72 may beimplemented in one or more modules. As an example, a first one of theimage processing modules 72 is shown as including cache memory, such asone or more of a level zero (L0) cache, a level one (L1) cache, a leveltwo (L2) cache, or a level three (L3) cache. In the example shown, thefirst image processing device may include a central processor 73 andL1-L3 caches 75. The central processor 73 may include a L0 cache 77. Thecentral processor 73 may also include a memory management module (MMM)79, which can control access to the caches 75, 77. Tasks described belowas being performed by an image processing device may be performed by,for example, the central processor 73 and/or the MMM 79.

The image processing devices 72 are connected to the FLC module 76 viathe system bus 74. The image processing devices 72 are connected to thestorage drive 78 via the bus and interfaces (i) between the imageprocessing devices 72 and the system bus 74, and (ii) between the systembus 74 and the storage drive 78. The interfaces may include, forexample, Ethernet interfaces, serial interfaces, PCIe interfaces and/orembedded multi-media controller (eMMC) interfaces. The storage drive 78may be located anywhere in the world away from the image processingdevices 72 and/or the FLC controller 80. The storage drive 78 may be incommunication with the image processing devices 72 and/or the FLCcontroller 80 via one or more networks (e.g., a WLAN, an Internetnetwork, or a remote storage network (or cloud)).

The FLC module 76 includes a FLC controller 80, a DRAM controller 82,and a DRAM IC 84. The DRAM IC 84 is used predominately as virtualstorage while the storage drive 78 is used as physical storage. Theimage processing devices 72 address the DRAM IC 84 and the storage drive78 as if they were a single storage device. While reading and/or writingdata, the image processing devices 72 send access requests to the FLCcontroller 80. The FLC controller 80 accesses the DRAM IC 84 via theDRAM controller 82 and/or accesses the storage drive 78. The FLCcontroller 80 may access the storage drive directly (as indicated bydashed line) or via the system bus 74.

Various examples of the data access system 70 are described herein. In afirst example, the FLC module 76 is implemented in a SoC separate fromthe image processing devices 72, the system bus 74 and the storage drive78. In a second example, one of the image processing devices 72 is a CPUimplemented image processing device. The one of the image processingdevices 72 may be implemented in a SoC separate from the FLC module 76and the storage drive 78. As another example, the image processingdevices 72 and the system bus 74 are implemented in a SoC separate fromthe FLC module 76 and the storage drive 78. In another example, theimage processing devices 72, the system bus 74 and the FLC module 76 areimplemented in a SoC separate from the storage drive 78. Other examplesof the data access system 70 are disclosed below.

The DRAM IC 84 may be used as a final level of cache. The DRAM IC 84 mayhave various storage capacities. For example, the DRAM IC 84 may have1-4 GB of storage capacity for mobile phone applications, 4-32 GB ofstorage capacity for personal computer applications, and 32 GB-1terabyte (T) of storage capacity for server applications.

The storage drive 78 may include flash memory (e.g., NAND flash memory),solid-state memory, a solid-state drive (SSD), a hard disk drive (HDD),and/or other nonvolatile memory. The storage drive 78 may be a hybriddrive and include, for example, solid-state memory and rotating storagemedia. The storage drive 78 may have more storage capacity than the DRAMIC 84. For example, the storage drive 78 may include 4-16 times morestorage than the DRAM IC 84. As another example, the storage drive 78may have an order of magnitude more storage capacity than the DRAM IC84. The DRAM IC 84 may include high-speed DRAM and the storage drive 78may include low-speed DRAM. In other words, speed of the DRAM IC 84 isfaster than speed of the DRAM in the storage drive 78.

The data stored in the DRAM IC 84 may be data that is accessed mostrecently, most often, and/or has the highest associated priority level.The data stored in the DRAM IC 84 may include data that is locked. Datathat is locked refers to data that is always stored in the DRAM IC 84.Locked data may be updated. The data stored in the DRAM IC 84 may beaccessed more frequently and/or have higher priority levels than datastored in the storage drive 78.

In some examples, the data stored in the DRAM IC 84 does not includesoftware applications, fonts, software code, alternate code and data tosupport different spoken languages, etc. that are not frequently used(e.g., accessed more than a predetermined number of times over apredetermined period of time). This can aid in minimizing sizerequirements of the DRAM IC 84. Software code that is not frequentlyused may be referred to as “garbage code” and may not be loaded from thestorage drive 78 to the DRAM IC 84 during a boot up process. The boot upprocess may include only loading up frequently used data. As the size ofthe DRAM IC 84 decreases, performance increases and power consumption,capacitance and buffering decrease. As capacitance and bufferingdecrease, latencies decrease. Also, by consuming less power, the batterylife of a corresponding device is increased.

The FLC controller 80 performs CAM techniques in response to receivingrequests from the image processing devices 72. The CAM techniquesinclude converting first physical address of the requests provided bythe image processing devices 72 to virtual addresses. These virtualaddresses are independent of and different than virtual addressesoriginally generated by the image processing devices 72 and mapped tothe first physical addresses by the image processing devices 72. TheDRAM controller 82 converts (or maps) the virtual addresses generated bythe FLC controller 80 to second physical addresses. If the secondphysical addresses are not in the DRAM IC 84, the FLC controller 80 may(i) fetch the data from the storage drive 78, or (ii) may indicate to(or signal) the corresponding one of the image processing devices 72that a cache miss has occurred. Fetching the data from the storage drive78 may include mapping the virtual addresses generated by the FLCcontroller 80 to third physical addresses to access the data in thestorage drive 78. A cache miss may be detected by the FLC controller 80while translating a physical address to a virtual address and/or by theDRAM controller 82 while translating the virtual address to a secondphysical address. The DRAM controller 82 may signal the FLC controller80 that a cache miss has occurred and then the FLC controller 80 maysignal one of the image processing devices 72 of the cache miss or mayaccess the storage drive 78 for the data.

If the FLC controller 80 signals the corresponding one of the imageprocessing devices 72 that a cache miss has occurred, then thecorresponding one of the image processing devices 72 may access the datain the storage drive 78. This may include (i) accessing the data in thestorage drive 78 based on the first physical addresses, (ii) mapping theoriginally generated virtual addresses to the third physical addressesand then accessing the storage drive 78 based on the third physicaladdresses, or (iii) mapping the first physical addresses to the thirdphysical addresses and then accessing the storage drive 78 based on thethird physical addresses. The CAM techniques include address mappingbetween the DRAM IC 84 and the storage drive 78.

For example, the CAM techniques may provide full set associative addresstranslation. This may include comparing the first physical addresses toall virtual addresses stored in a directory of the FLC controller 80.Full set associative address translation may be used by the FLCcontroller 80 to translate the first physical addresses of correspondingdata requests to the second virtual addresses (or the virtual addressesgenerated by the FLC controller 80). This may include comparing thefirst physical addresses to all addresses in a first directory to findmatches for conversion to virtual addresses. Full set associativeaddress translation may also be used by the DRAM controller 82 tocompare the second virtual addresses to all addresses of all entries ina second directory, the DRAM IC 84, and/or the storage drive 78 to findmatches for conversion to second physical addresses. A hit rate of databeing located in the DRAM IC 84 after initial boot up may be as high as100% depending on the size of the DRAM IC 84. The DRAM IC 84 may besized to assure a near 100% hit rate with minimal idle time of aprocessor and/or image processing device. For example, this may beaccomplished using a 1-4 GB DRAM IC for mobile phone applications, 4-32GB DRAM ICs for personal computer applications, and 32-500 GB DRAM ICsfor server applications.

In addition to FIG. 2, FIG. 3 shows entries of the DRAM IC 84 and thestorage drive 78 of the data access system 70. The DRAM IC 84 mayinclude DRAM entries_(00-MN). The storage drive 78 may have driveentries_(00-MN). Addresses of each of the DRAM entries_(00-MN) may bemapped to one or more addresses of the drive entries_(00-MN). As aresult, first portions of data stored in one or more of the DRAMentries_(00-MN) may correspond to second portions of the data stored inthe drive entries_(00-MN). The data stored in the DRAM entries_(00-MN)may include metadata providing information regarding the data stored inthe drive entries_(00-MN). The information may include data types and/orlengths of the data stored in the drive entries_(00-MN).

As an example, each of the DRAM entries_(00-MN) may have, for example,16 KB of storage capacity. Each of the drive entries_(00-MN) may have 16GB of storage capacity. If data is to be read from or written to one ofthe DRAM entries_(00-MN) and the one of the DRAM entries_(00-MN) is fulland/or does not have all of the data associated with a request, acorresponding one of the drive entries_(00-MN) is accessed. Thus, theDRAM IC 84 and the storage drive 78 may be divided up into blocks ofmemory. Each block of memory in the DRAM IC 84 may have a respective oneor more blocks of memory in the storage drive 78. This mapping anddivision of memory may be transparent to the image processing devices 72of FIG. 2.

During operation, one of the image processing devices 72 may generate arequest signal for a block of data. If a block of data is not located inthe DRAM IC 84, the FLC controller 80 may access the block of data inthe storage drive 78. While the FLC controller 80 is accessing the datafrom the storage drive 78, the FLC controller 80 may send a bus errorsignal (or alert signal) back to the image processing device thatrequested the data. The bus error signal may indicate that the FLCcontroller 80 is accessing the data and as a result the system bus 74 isnot ready for transfer of the data to the image processing device 72.The transmission of the bus error signal may be referred to as a “busabort” from the FLC module 76 to the image processing device and/or SoCof the image processing device 72. The image processing device 72 mayperform other tasks while waiting for the bus to be ready. The othertasks may include using data already stored in, for example, one or morecaches (e.g., L0-L3 caches) in the SoC of the image processing device.This also minimizes idle time of a processor and/or image processingdevice.

If sequential access is performed, the FLC controller 80 and/or the DRAMcontroller 82 may perform predictive fetching of data stored ataddresses expected to be accessed in the future. This may occur during aboot up and/or subsequent to the boot up. The FLC controller 80 and/orthe DRAM controller 82 may: track data and/or software usage; evaluateupcoming lines of code to be executed; track memory access patterns; andbased on this information predict next addresses of data expected to beaccessed. The next addresses may be addresses of the DRAM IC 84 and/orthe storage drive 78. As an example, the FLC controller 80 and/or theDRAM controller 82, independent of and/or without previously receiving arequest for data, may access the data stored in the storage drive 78 andtransfer the data to the DRAM IC 84. As another example, the FLCcontroller 80 and/or the DRAM controller 82, independent of and/orwithout previously receiving a request for data, may access the datastored in the DRAM IC 84 and transfer the data to the system bus 74and/or one of the image processing devices 72.

Operation of the data access system 70 is further described with respectto the method of FIG. 4. Although the following tasks are primarilydescribed with respect to the examples in FIGS. 2-4, the tasks may beeasily modified to apply to other examples in the present disclosure.The tasks may be performed iteratively.

The method starts at 100. At 102, the FLC controller 80 receives arequest from one of the image processing devices 72. The request may bea read request or a write request.

At 104, the FLC controller 80 determines whether the received request isa read request. Task 106 is performed if the request is a read request,otherwise task 122 is performed. At 106, the FLC controller 80 convertsa first physical address provided in the received request to a virtualaddress. The virtual address may be associated with a physical addressin the DRAM IC 84 and/or a physical address in the storage drive 78.

At 108, the DRAM controller 82 converts the virtual address to a secondphysical address. The FLC controller 80 and/or the DRAM controller 82may include one or more translation mapping tables for mapping firstphysical addresses to virtual addresses and for mapping the virtualaddresses to second physical addresses. The tables may be shared betweenthe FLC controller 80 and the DRAM controller 82.

At 110, the DRAM controller 82 determines whether the second physicaladdress is in the DRAM IC 84 and thus whether a corresponding block ofdata is in allocated space of the DRAM IC 84. If the second physicaladdress is in the DRAM IC 84, task 112 is performed, otherwise task 114is performed.

At 112 and based on the second physical address, the DRAM controller 82reads one or more first blocks of data associated with the receivedrequest from the DRAM IC 84. Each of the first blocks of data may have acorresponding physical address in the DRAM IC 84.

At 114 and based on the second physical address, the FLC controller 80reads one or more second blocks of data associated with the receivedrequest from the storage drive 78. The one or more second blocks of datamay include the first blocks of data. Each of the second blocks of datamay have a corresponding physical address in the storage drive 78. Thesecond blocks of data and corresponding addresses of the storage drive78 may correspond respectively to the first blocks of data andcorresponding addresses of the DRAM IC 84.

At 116, the data read from the DRAM IC 84 or the storage drive 78 isforwarded to the image processing device that sent the received request.At 118, for the request received at 102, the FLC controller 80 and/orthe DRAM controller 82 may determine whether there is additional data tobe read from the DRAM IC 84 and/or the storage drive 78. If there isadditional data to be read, task 110 is performed, otherwise the methodmay end at 120. As an alternative to returning to task 110 and for therequest received at 102, if there is additional data to be read and ifthere is another physical address to be converted, task 106 may beperformed subsequent to task 118.

At 122, the FLC controller 80 determines whether the received request isa write request. If the received request is a write request, task 126 isperformed, otherwise the method may end at 124. At 126, the FLCcontroller 80 converts the first physical address provided in thereceived request to a virtual address. The virtual address may beassociated with a physical address in the DRAM IC 84 and/or a physicaladdress in the storage drive 78. At 128, the DRAM controller 82 convertsthe virtual address to a second physical address. Tasks 126 and 128 maybe accomplished using the above-mentioned mapping tables.

At 130, the DRAM controller 82 determines whether the second physicaladdress is in the DRAM IC 84 and thus whether a corresponding block ofdata is to be written to an allocated space in the DRAM IC 84. If thesecond physical address is in the DRAM IC 84, task 132 is performed,otherwise task 134 is performed.

At 132 and based on the second physical address, the DRAM controller 82writes one or more first blocks of data associated with the receivedrequest to the DRAM IC 84. Each of the first blocks of data may have acorresponding physical address in the DRAM IC 84.

At 134 and based on the second physical address, the FLC controller 80writes one or more second blocks of data associated with the receivedrequest to the storage drive 78. The one or more second blocks of datamay include the first blocks of data. Each of the second blocks of datamay have a corresponding physical address in the storage drive 78. Thesecond blocks of data and corresponding addresses of the storage drive78 may correspond respectively to the first blocks of data andcorresponding addresses of the DRAM IC 84.

At 136, for the request received at 102, the FLC controller 80 and/orthe DRAM controller 82 may determine whether there is additional data tobe written to the DRAM IC 84 and/or the storage drive 78. If there isadditional data to be written, task 130 is performed, otherwise themethod may end at 138. As an alternative to returning to task 130 andfor the request received at 102, if there is additional data to bewritten and if there is another physical address to be converted, task126 may be performed subsequent to task 136.

The above-described tasks of FIG. 4 are meant to be illustrativeexamples; the tasks may be performed sequentially, synchronously,simultaneously, continuously, during overlapping time periods or in adifferent order depending upon the application. Also, any of the tasksmay not be performed or skipped depending on the example and/or sequenceof events.

The above-described examples may be implemented via servers in a network(may be referred to as a “cloud”). Each of the servers may include a FLCmodule (e.g., the FLC module 76) and communicate with each other. Theservers may share DRAM and/or memory stored in the DRAM ICs and thestorage drives. Each of the servers may access the DRAMs and/or storagedrives in other servers via the network. Each of the FLC modules mayoperate similar to the FLC module of FIG. 2, but may also access DRAMand/or memory in each of the other servers via the cloud. Signalstransmitted between the servers and the cloud may be encrypted prior totransmission and decrypted upon arrival at the server and/or networkdevice of the cloud. The servers may also share and/or access memory inthe cloud. As an example, a virtual address generated by a FLCcontroller of one of the servers may correspond to a physical addressin: a DRAM of the FLC module of the FLC controller; a storage drive ofthe one of the servers; a DRAM of a FLC module of one of the otherservers; a storage drive of one of the other servers; or a storagedevice of the cloud. The FLC controller and/or an image processingdevice of the one of the servers may access the DRAM and/or memory inthe other FLC modules, storage drives, and/or storage devices if a cachemiss occurs.

The above-described examples may also be implemented in a data accesssystem including: a multi-chip module having multiple chips; a switch;and a primary chip having a primary FLC module. The multi-chip module isconnected to the primary chip module via the switch. Each of the FLCmodules may operate similar to the FLC module of FIG. 2, but may alsoaccess DRAM and/or memory in each of the other chips via the switch. Asan example, a virtual address generated by a FLC controller of one ofthe chips may correspond to a physical address in: a DRAM of the FLCmodule of the FLC controller; a storage drive of the one of the chips; aDRAM of a FLC module of one of the other chips; a storage drive of oneof the other chips; or a storage device of the cloud. The FLC controllerand/or an image processing device of the one of the chips may access theDRAM and/or memory in the other FLC modules, storage drives, and/orstorage devices if a cache miss occurs.

As an example, each of the secondary DRAMs in the multi-chip module andthe primary DRAM in the primary chip may have 1 GB of storage capacity.A storage drive in the primary chip may have, for example, 64 GB ofstorage capacity. As another example, the data access system may be usedin an automotive vehicle. The primary chip may be, for example, acentral controller, a module, a processor, an engine control module, atransmission control module, and/or a hybrid control module. The primarychip may be used to control corresponding aspects of related systems,such as a throttle position, spark timing, fuel timing, transitionsbetween transmission gears, etc. The secondary chips in the multi-chipmodule may each be associated with a particular vehicle system, such asa lighting system, an entertainment system, an air-conditioning system,an exhaust system, a navigation system, an audio system, a video system,a braking system, a steering system, etc. and used to control aspects ofthe corresponding systems.

As yet another example, the above-described examples may also beimplemented in a data access system that includes a host (or SoC) and ahybrid drive. The host may include a central processor or other imageprocessing device and communicate with the hybrid drive via aninterface. The interface may be, for example, a GE interface, a USBinterface, a SATA interface, a PCIe interface, or other suitableinterface. The hybrid drive includes a first storage drive and a secondstorage drive. The first storage drive includes an FLC module (e.g., theFLC module 76 of FIG. 2). A FLC controller of the FLC module performsCAM techniques when determining whether to read data from and/or writedata to DRAM of the FLC module and the second storage drive.

As a further example, the above-described examples may also beimplemented in a storage system that includes a SoC, a first DRAM (orcache), a second DRAM, and a nonvolatile memory. The SoC is separatefrom the first DRAM, the discrete DRAM and the nonvolatile memory. Thefirst DRAM may store high-priority and/or frequently accessed data. Ahigh-percentage of data access requests may be directed to data storedin the first DRAM. As an example, 99% or more of the data accessrequests may be directed to data stored in the first DRAM and theremaining 1% or less of the data access requests may be directed to datastored in the second DRAM and/or the nonvolatile memory. Low-priorityand/or less frequently accessed data may be stored in the second DRAMand/or the nonvolatile memory. As an example, a user may have multipleweb browsers open. The second DRAM can have a high-bandwidth interfaceand low-cost-per-bit memory storage capacity and can handle a wide rangeof applications. The second DRAM typically exhibits longer latencyperiods than cache or the first DRAM. Content for a currently used or amost frequently used web browser may be stored in the first DRAM,whereas content for the other web browsers may be stored in the secondDRAM and/or the nonvolatile memory.

The SoC may include one or more control modules, an interface module, acache (or FLC) module, and a graphics module. The cache module mayoperate similar to the FLC module of FIG. 2. The control modules areconnected to the cache module via the interface module. The cache moduleis configured to access the first DRAM, the second DRAM and thenon-volatile memory based on respective hierarchical levels. Each of thecontrol modules may include respective L1, L2, and L3 caches. Each ofthe control modules may also include one or more additional caches, suchas L4 cache or other highest-level cache. Many signal lines (orconductive elements) may exist between the SoC and the first DRAM. Thisallows for quick parallel and/or serial transfer of data between the SoCand the first DRAM. Data transfer between the SoC and the first DRAM isquicker than data transfer (i) between the SoC and the second DRAM, and(ii) between the SoC and the nonvolatile memory.

The first DRAM may have a first portion with a same or higherhierarchical level than the L3 cache 622, the L4 cache, and/or thehighest-level cache. A second portion of the first DRAM may have a sameor lower hierarchical level than the second DRAM and/or the nonvolatilememory. The second DRAM may have a higher hierarchical level than thefirst DRAM. The nonvolatile memory may have a same or higherhierarchical level than the second DRAM. The control modules may changehierarchical levels of portions or all of each of the first DRAM, thesecond DRAM, and/or the nonvolatile memory based on, for example,caching needs.

The control modules, a graphics module connected to the interfacemodule, and/or other devices (internal or external to the SoC) connectedto the interface module may send request signals to the cache module tostore and/or access data in the first DRAM, the second DRAM, and/or thenonvolatile memory. The cache module may control access to the firstDRAM, the second DRAM, and the nonvolatile memory. As an example, thecontrol modules, the graphics module, and/or other devices connected tothe interface module may be unaware of the number and/or size of DRAMsthat are connected to the SoC.

The cache module may convert first logical block addresses and/orrequests received from the control modules, the graphics module, and/orother devices connected to the interface module to (i) physical blockaddresses of the first DRAM, the second DRAM, and/or the nonvolatilememory, or (ii) second logical block addresses. The second logical blockaddresses may be converted to physical block addresses by the firstDRAM, the second DRAM, and/or the nonvolatile memory. The cache modulemay store one or more lookup tables (e.g., fully set associative lookuptables) for the conversion of the first logical block addresses to thesecond logical block addresses and/or conversion of the first logicalblock addresses to physical block addresses. As a result, the cachemodule and one or more of the first DRAM, the second DRAM, and thenonvolatile memory may operate as a single memory relative to thecontrol modules, the graphics module, and/or other devices connected tothe interface module. The graphics module may control output of videodata from the control modules and/or the SoC to a display and/or theother video device.

The control modules may swap (or transfer) data, data sets, programs,and/or portions thereof between (i) the cache module, and (ii) the L1cache, L2 cache, and L3 cache. The cache module may swap (or transfer)data, data sets, programs and/or portions thereof between two or more ofthe first DRAM, the second DRAM and the nonvolatile memory. This may beperformed independent of the control modules and/or without receivingcontrol signals from the control modules to perform the transfer. Thestorage location of data, data sets, programs and/or portions thereof inone or more of the first DRAM, the second DRAM and the nonvolatilememory may be based on the corresponding priority levels, frequency ofuse, frequency of access, and/or other parameters associated with thedata, data sets, programs and/or portions thereof. The transferring ofdata, data sets, programs and/or portions thereof may includetransferring blocks of data. Each of the blocks of data may have apredetermined size. As an example, a swap of data from the second DRAMto the first DRAM may include multiple transfer events, where eachtransfer event includes transferring a block of data (e.g., 16 KB ofdata).

The cache module may use the first DRAM as set associative cache,directed mapped cache, and/or fully associative cache and access thefirst DRAM using corresponding cache protocols. The cache module may bereferred to as a last (or highest) level cache (LLC) controller.

The first DRAM may have a first predetermined amount of storage capacity(e.g., 0.25 GB, 0.5 GB, 1 GB, or 8 GB). A 0.5 GB first DRAM is 512 timesas large as a typical L2 cache. The second DRAM may have a secondpredetermined amount of storage capacity (e.g., 1 GB or more fornon-server based systems or 256 GB or more server based systems). Thenonvolatile memory may have a third predetermined amount of storagecapacity (e.g., 256 GB or more). The nonvolatile memory may includesolid-state memory, such as flash memory or magneto resistive randomaccess memory (MRAM), and/or rotating magnetic media. The nonvolatilememory may include a SSD and a HDD. Although the storage system has thesecond DRAM and the nonvolatile memory, either one of the second DRAMand the nonvolatile memory may not be included in the storage system.

As a further example, the above-described examples may also beimplemented in a storage system that includes a SoC and a DRAM IC. TheSoC may include multiple control modules (or processors) that access theDRAM IC via a ring bus. The ring bus may be a bi-directional bus thatminimizes access latencies. If cost is more important than performance,the ring bus may be a unidirectional bus. Intermediary devices may belocated between the control modules and the ring bus and/or between thering bus and the DRAM IC. For example, the above-described cache modulemay be located between the control modules and the ring bus or betweenthe ring bus and the DRAM IC.

The DRAM IC may be a L3, L4, and/or highest level cache. The controlmodules may share the DRAM IC and/or have designated portions of theDRAM IC. For example, a first portion of the DRAM IC may be allocated ascache for the first control module. A second portion of the DRAM IC maybe allocated as cache for the second control module. A third portion ofthe DRAM IC may be allocated as cache for the third control module. Afourth portion of the DRAM IC may not be allocated as cache.

As a further example, the above-described examples may also beimplemented in a server system. The server system may be referred to asa storage system and include multiple servers. The servers includerespective storage systems, which are in communication with each othervia a network (or cloud). One or more of the storage systems may belocated in the cloud. Each of the storage systems may include respectiveSoCs.

The SoCs may have respective first DRAMs, second DRAMs, solid-statenonvolatile memories, nonvolatile memories and I/O ports. The I/O portsmay be in communication with the cloud via respective I/O channels, suchas peripheral component interconnect express (PCIe) channels, andrespective network interfaces, such as such as peripheral componentinterconnect express (PCIe) channels. The I/O ports, I/O channels, andnetwork interfaces may be Ethernet ports, channels and networkinterfaces and transfer data at predetermined speeds (e.g., 1 gigabitper second (Gb/s), 10 Gb/s, 50 Gb/s, etc.). Some of the networkinterfaces may be located in the cloud. The connection of multiplestorage systems provides a low-cost, distributed, and scalable serversystem. Multiples of the disclosed storage systems and/or server systemsmay be in communication with each other and be included in a network (orcloud).

The solid-state nonvolatile memories may each include, for example, NANDflash memory and/or other solid-state memory. The nonvolatile memoriesmay each include solid-state memory and/or rotating magnetic media. Thenonvolatile memories may each include a SSD and/or a HDD.

The architecture of the server system provides DRAMs as caches. TheDRAMs may be allocated as L3, L4 and/or highest level caches for therespective SoCs and have a high-bandwidth and large storage capacity.The stacked DRAMs may include, for example, DDR3 memory, DDR4 memory,low power double data rate type four (LPDDR4) memory, wide-I/O2 memory,HMC memory, and/or other suitable DRAM. Each of the SoCs may have one ormore control modules. The control modules communicate with thecorresponding DRAMs via respective ring buses. The ring buses may bebi-directional buses. This provides high-bandwidth and minimal latencybetween the control modules and the corresponding DRAMs.

Each of the control modules may access data and/or programs stored: incontrol modules of the same or different SoC; in any of the DRAMs; inany of the solid-state nonvolatile memories; and/or in any of thenonvolatile memories.

The SoCs and/or ports of the SoCs may have medium access controller(MAC) addresses. The control modules (or processors) of the SoCs mayhave respective processor cluster addresses. Each of the control modulesmay access other control modules in the same SoC or in another SoC usingthe corresponding MAC address and processor cluster address. Each of thecontrol modules of the SoCs may access the DRAMs. A control module of afirst SoC may request data and/or programs stored in a DRAM connected toa second SoC by sending a request signal having the MAC address of thesecond SOC and the processor cluster address of a second control modulein the second SoC.

Each of the SoCs and/or the control modules in the SoCs may store one ormore address translation tables. The address translation tables mayinclude and/or provide translations for: MAC addresses of the SoCs;processor cluster addresses of the control modules; logical blockaddresses of memory cells in the DRAMs, the solid-state nonvolatilememories, and the nonvolatile memories; and/or physical block addressesof memory cells in the DRAMs, the solid-state nonvolatile memories, andthe nonvolatile memories.

As an example, data and programs may be stored in the solid-statenonvolatile memories and/or the nonvolatile memories. The data andprograms and/or portions thereof may be distributed over the network tothe SoCs and control modules. Programs and/or data needed for executionby a control module may be stored locally in the DRAMs, a solid-statenonvolatile memory, and/or a nonvolatile memory of the SoC in which thecontrol module is located. The control module may then access andtransfer the programs and/or data needed for execution from the DRAMs,the solid-state nonvolatile memory, and/or the nonvolatile memory tocaches in the control module. Communication between the SoCs and thenetwork and/or between the SoCs may include wireless communication.

As a further example, the above-described examples may also beimplemented in a server system that includes SoCs. Some of the SoCs maybe incorporated in respective servers and may be referred to as serverSoCs. Some of the SoCs (referred to as companion SoCs) may beincorporated in a server of a first SoC or may be separate from theserver of the first SoC. The server SoCs include respective: clusters ofcontrol modules (e.g., central processing modules); intra-cluster ringbuses, FLC modules, memory control modules, FLC ring buses, and one ormore hopping buses. The hopping buses extend (i) between the server SoCsand the companion SoCs via inter-chip bus members and correspondingports and (ii) through the companion SoCs. A hopping bus may refer to abus extending to and from hopping bus stops, adaptors, or nodes andcorresponding ports of one or more SoCs. A hopping bus may extendthrough the hopping bus stops and/or the one or more SoCs. A singletransfer of data to or from a hopping bus stop may be referred to as asingle hop. Multiple hops may be performed when transferring databetween a transmitting device and a receiving device. Data may travelbetween bus stops each clock cycle until the data reaches a destination.Each bus stop disclosed herein may be implemented as a module andinclude logic to transfer data between devices based on a clock signal.Also, each bus disclosed herein may have any number of channels for theserial and/or parallel transmission of data.

Each of the clusters of control modules has a corresponding one of theintra-cluster ring buses. The intra-cluster ring buses arebi-directional and provide communication between the control modules ineach of the clusters. The intra-cluster ring buses may have ring busstops for access by the control modules to data signals transmitted onthe intra-cluster ring buses. The ring bus stops may perform as signalrepeaters and/or access nodes. The control modules may be connected toand access the intra-cluster ring buses via the ring bus stops. Data maybe transmitted around the intra-cluster ring buses from a first controlmodule at a first one of the ring bus stops to a second control moduleat a second one of the ring bus stops. Each of the control modules maybe a central processing unit or processor.

Each of the memory control modules may control access to the respectiveone of the FLC modules. The FLC modules may be stacked on the serverSoCs. Each of the FLC modules includes a FLC (or DRAM) and may beimplemented as and operate similar to any of the FLC modules disclosedherein. The memory control modules may access the FLC ring buses atrespective ring bus stops on the FLC ring buses and transfer databetween the ring bus stops and the FLC modules. Alternatively, the FLCmodules may directly access the FLC ring buses at respective ring busstops. Each of the memory control modules may include memory clocks thatgenerate memory clock signals for a respective one of the FLC modulesand/or for the bus stops of the ring buses and/or the hopping buses. Thebus stops may receive the memory clock signals indirectly via the ringbuses and/or the hopping buses or directly from the memory controlmodules. Data may be cycled through the bus stops based on the memoryclock signal.

The FLC ring buses may be bi-directional buses and have two types ofring bus stops S_(RB) and S_(RH). Each of the ring bus stops may performas a signal repeater and/or as an access node. The ring bus stops S_(RB)are connected to devices other than hopping buses. The devices mayinclude: an inter-cluster ring bus0; the FLC modules and/or memorycontrol modules; and graphics processing modules. The inter-cluster ringbus provides connections (i) between the clusters, and (ii) betweenintersection rings stops. The intersection ring bus stops provide accessto and may connect the inter-cluster ring bus to ring bus extensionsthat extend between (i) the clusters and (ii) ring bus stops. The ringbus stops are on the FLC ring buses. The inter-cluster ring bus and theintersection ring bus stops provide connections (iii) between the firstcluster and the ring bus stop of the second FLC ring bus, and (iv)between the second cluster and the ring bus stop of the first FLC ringbus. This allows the control modules to access the FLC of the second FLCmodule and the control modules to access the FLC of the first FLCmodule.

The inter-cluster ring bus may include intra-chip traces and inter-chiptraces. The intra-chip traces extend internal to the server SoCs andbetween (i) one of the ring bus stops and (ii) one of the ports. Theinter-chip traces extend external to the server SoCs and betweenrespective pairs of the ports.

The ring bus stops S_(RH) of each of the server SoCs are connected tocorresponding ones of the FLC ring buses and hopping buses. Each of thehopping buses has multiple hopping bus stops S_(HB), which providerespective interfaces access to a corresponding one of the hoppingbuses. The hopping bus stops S_(HB) may perform as signal repeatersand/or as access nodes.

The first hopping bus, a ring bus stop, and first hopping bus stopsprovide connections between (i) the FLC ring bus and (ii) a liquidcrystal display (LCD) interface in the server SoC and interfaces of thecompanion SoCs. The LCD interface may be connected to a display and maybe controlled via the GPM. The interfaces of the companion SoC include aserial attached small computer system interface (SAS) interface and aPCIe interface. The interfaces of the companion SoC are image processor(IP) interfaces.

The interfaces are connected to respective ports, which may be connectedto devices, such as peripheral devices. The SAS interface and the PCIeinterface may be connected respectively to a SAS compatible device andPCIe compatible device via the ports. As an example, a storage drive maybe connected to the port. The storage drive may be a hard disk drive, asolid-state drive, or a hybrid drive. The ports may be connected toimage processing devices. Examples of image processing devices aredisclosed above. The fourth SoC may be daisy chained to the third SoCvia the inter-chip bus member (also referred to as a daisy chainmember). The inter-chip bus member is a member of the first hopping bus.Additional SoCs may be daisy chained to the fourth SoC via port, whichis connected to the first hopping bus. The server SoC, the controlmodules, and the FLC module may communicate with the fourth SoC via theFLC ring bus, the first hopping bus and/or the third SoC. As an example,the SoCs may be southbridge chips and control communication and transferof interrupts between (i) the server SoC and (ii) peripheral devicesconnected to the ports.

The second hopping bus provides connections, via a ring bus stop andsecond hopping bus stops, between (i) the FLC ring bus and (ii)interfaces in the server SoC. The interfaces in the server SoC mayinclude an Ethernet interface, one or more PCIe interfaces, and a hybrid(or combination) interface. The Ethernet interface may be a 10GEinterface and is connected to a network via a first Ethernet bus. TheEthernet interface may communicate with the second SoC via the firstEthernet bus, the network and a second Ethernet bus. The network may bean Ethernet network, a cloud network, and/or other Ethernet compatiblenetwork. The one or more PCIe interfaces may include as examples a thirdgeneration PCIe interface PCIe3 and a mini PCIe interface (mPCIe). ThePCIe interfaces may be connected to solid-state drives. The hybridinterface may be SATA and PCIe compatible to transfer data according toSATA and/or PCIe protocols to and from SATA compatible devices and/orPCIe compatible devices. As an example, the PCIe interface may beconnected to a storage drive, such as a solid-state drive or a hybriddrive. The interfaces have respective ports for connection to devicesexternal to the server SoC.

The third hopping bus may be connected to the ring bus via a ring busstop and may be connected to a LCD interface and a port via a hoppingbus stop. The LCD interface may be connected to a display and may becontrolled via the GPM. The port may be connected to one or morecompanion SoCs. The fourth hopping bus may be connected to (i) the ringbus via a ring bus stop, and (ii) interfaces via hopping bus stops. Theinterfaces may be Ethernet, PCIe and hybrid interfaces. The interfaceshave respective ports.

The server SoCs and/or other server SoCs may communicate with each othervia the inter-cluster ring bus. The server SoCs and/or other server SoCsmay communicate with each other via respective Ethernet interfaces andthe network.

The companion SoCs may include respective control modules. The controlmodules may access and/or control access to the interfaces via thehopping bus stops. In one embodiment, the control modules are notincluded. The control modules may be connected to and in communicationwith the corresponding ones of the hopping bus stops and/or thecorresponding ones of the interfaces.

As a further example, the above-described examples may also beimplemented in a circuit of a mobile device. The mobile device may be acomputer, a cellular phone, or other a wireless network device. Thecircuit includes SoCs. The SoC may be referred to as a mobile SoC. TheSoC may be referred to as a companion SoC. The mobile SoC includes: acluster of control modules; an intra-cluster ring bus, a FLC module, amemory control module, a FLC ring bus, and one or more hopping buses.The hopping bus extends (i) between the mobile SoC and the companion SoCvia an inter-chip bus member and corresponding ports and (ii) throughthe companion SoC.

The intra-cluster ring bus is bi-directional and provides communicationbetween the control modules. The intra-cluster ring bus may have ringbus stops for access by the control modules to data signals transmittedon the intra-cluster ring bus. The ring bus stops may perform as signalrepeaters and/or access nodes. The control modules may be connected toand access the intra-cluster ring bus via the ring bus stops. Data maybe transmitted around the intra-cluster ring bus from a first controlmodule at a first one of the ring bus stops to a second control moduleat a second one of the ring bus stops. Data may travel between bus stopseach clock cycle until the data reaches a destination. Each of thecontrol modules may be a central processing unit or processor.

The memory control module may control access to the FLC module. In oneembodiment, the memory control module is not included. The FLC modulemay be stacked on the mobile SoC. The FLC module may a FLC or DRAM andmay be implemented as and operate similar to any of the FLC modulesdisclosed herein. The memory control module may access the FLC ring busat a respective ring bus stop on the FLC ring bus and transfer databetween the ring bus stop and the FLC module. Alternatively, the FLCmodule may directly access the FLC ring bus a respective ring bus stop.The memory control module may include a memory clock that generates amemory clock signal for the FLC module, the bus stops of the ring busand/or the hopping buses. The bus stops may receive the memory clocksignal indirectly via the ring bus and/or the hopping buses or directlyfrom the memory control module. Data may be cycled through the bus stopsbased on the memory clock signal.

The FLC ring bus may be a bi-directional bus and have two types of ringbus stops S_(RB) and S_(RH). Each of the ring bus stops may perform as asignal repeater and/or as an access node. The ring bus stops S_(RB) areconnected to devices other than hopping buses. The devices may include:the cluster; the FLC module and/or the memory control module; and agraphics processing module.

The ring bus stops S_(RH) of the mobile SoC are connected to the FLCring bus and a corresponding one of the hopping buses. Each of thehopping buses has multiple hopping bus stops S_(HB), which providerespective interfaces access to a corresponding one of the hoppingbuses. The hopping bus stops S_(HB) may perform as signal repeatersand/or as access nodes.

The first hopping bus, a ring bus stop, and first hopping bus stops areconnected between (i) the FLC ring bus and (ii) a liquid crystal display(LCD) interface, a video processing module (VPM), and interfaces of thecompanion SoC. The LCD interface is in the server SoC and may beconnected to a display and may be controlled via the GPM. The interfacesof the companion SoC include a cellular interface, a wireless local areanetwork (WLAN) interface, and an image signal processor interface. Thecellular interface may include a physical layer device for wirelesscommunication with other mobile and/or wireless devices. The physicallayer device may operate and/or transmit and receive signals accordingto long-term evolution (LTE) standards and/or third generation (3G),fourth generation (4G), and/or fifth generation (5G) mobiletelecommunication standards. The WLAN interface may operate according toBluetooth®, Wi-Fi®, and/or other WLAN protocols and communicate withother network devices in a WLAN of the mobile device. The ISP interfacemay be connected to image processing devices (or image signal processingdevices) external to the companion SoC, such as a storage drive or otherimage processing device. The interfaces may be connected to devicesexternal to the companion SoC via respective ports. The ISP interfacemay be connected to devices external to the mobile device.

The companion SoC may be connected to the mobile SoC via the inter-chipbus member. The inter-chip bus member is a member of the first hoppingbus. Additional SoCs may be daisy chained to the companion SoC via aport, which is connected to the first hopping bus. The mobile SoC, thecontrol modules, and the FLC module may communicate with the companionSoC via the FLC ring bus and the first hopping bus.

The second hopping bus provides connections via a ring bus stop andsecond hopping bus stops between (i) the FLC ring bus and (ii)interfaces in the mobile SoC. The interfaces in the mobile SoC mayinclude an Ethernet interface, one or more PCIe interfaces, and a hybrid(or combination) interface. The Ethernet interface may be a 10GEinterface and is connected to an Ethernet network via a port. The one ormore PCIe interfaces may include as examples a third generation PCIeinterface PCIe3 and a mini PCIe interface (mPCIe). The PCIe interfacesmay be connected to solid-state drives. The hybrid interface may be SATAand PCIe compatible to transfer data according to SATA and/or PCIeprotocols to and from SATA compatible devices and/or PCIe compatibledevices. As an example, the PCIe interface may be connected to a storagedrive via a port. The storage drive may be a solid-state drive or ahybrid drive. The interfaces have respective ports for connection todevices external to the mobile SoC.

The companion SoC may include a control module. The control module mayaccess and/or control access to the VPM and the interfaces via thehopping bus stops. In one embodiment, the control module is notincluded. The control module may be connected to and in communicationwith the hopping bus stops, the VPM 1198, and/or the interfaces.

The wireless communications described in the present disclosure can beconducted in full or partial compliance with IEEE standard 802.11-2012,IEEE standard 802.16-2009, IEEE standard 802.20-2008, and/or BluetoothCore Specification v4.0. In various implementations, Bluetooth CoreSpecification v4.0 may be modified by one or more of Bluetooth CoreSpecification Addendums 2, 3, or 4. In various implementations, IEEE802.11-2012 may be supplemented by draft IEEE standard 802.11ac, draftIEEE standard 802.11ad, and/or draft IEEE standard 802.11ah.

Although the terms first, second, third, etc. may be used herein todescribe various chips, modules, signals, elements, and/or components,these items should not be limited by these terms. These terms may beonly used to distinguish one item from another item. Terms such as“first,” “second,” and other numerical terms when used herein do notimply a sequence or order unless clearly indicated by the context. Thus,a first item discussed below could be termed a second item withoutdeparting from the teachings of the example examples.

Also, various terms are used to describe the physical relationshipbetween components. When a first element is referred to as being“connected to”, “engaged to”, or “coupled to” a second element, thefirst element may be directly connected, engaged, disposed, applied, orcoupled to the second element, or intervening elements may be present.In contrast, when an element is referred to as being “directly connectedto”, “directly engaged to”, or “directly coupled to” another element,there may be no intervening elements present. Stating that a firstelement is “connected to”, “engaged to”, or “coupled to” a secondelement implies that the first element may be “directly connected to”,“directly engaged to”, or “directly coupled to” the second element.Other words used to describe the relationship between elements should beinterpreted in a like fashion (e.g., “between” versus “directlybetween”, “adjacent” versus “directly adjacent”, etc.).

The foregoing description is merely illustrative in nature and is in noway intended to limit the disclosure, its application, or uses. Thebroad teachings of the disclosure can be implemented in a variety offorms. Therefore, while this disclosure includes particular examples,the true scope of the disclosure should not be so limited since othermodifications will become apparent upon a study of the drawings, thespecification, and the following claims. As used herein, the phrase atleast one of A, B, and C should be construed to mean a logical (A OR BOR C), using a non-exclusive logical OR, and should not be construed tomean “at least one of A, at least one of B, and at least one of C.” Itshould be understood that one or more steps within a method may beexecuted in different order (or concurrently) without altering theprinciples of the present disclosure.

In this application, including the definitions below, the term ‘module’or the term ‘controller’ may be replaced with the term ‘circuit.’ Theterm ‘module’ and the term ‘controller’ may refer to, be part of, orinclude: an Application Specific Integrated Circuit (ASIC); a digital,analog, or mixed analog/digital discrete circuit; a digital, analog, ormixed analog/digital integrated circuit; a combinational logic circuit;a field programmable gate array (FPGA); a processor circuit (shared,dedicated, or group) that executes code; a memory circuit (shared,dedicated, or group) that stores code executed by the processor circuit;other suitable hardware components that provide the describedfunctionality; or a combination of some or all of the above, such as ina system-on-chip.

A module or a controller may include one or more interface circuits. Insome examples, the interface circuits may include wired or wirelessinterfaces that are connected to a local area network (LAN), theInternet, a wide area network (WAN), or combinations thereof. Thefunctionality of any given module or controller of the presentdisclosure may be distributed among multiple modules and/or controllersthat are connected via interface circuits. For example, multiple modulesand/or controllers may allow load balancing. In a further example, aserver (also known as remote, or cloud) module or (remote, or cloud)controller may accomplish some functionality on behalf of a clientmodule and/or a client controller.

The term code, as used above, may include software, firmware, and/ormicrocode, and may refer to programs, routines, functions, classes, datastructures, and/or objects. The term shared processor circuitencompasses a single processor circuit that executes some or all codefrom multiple modules and/or controllers. The term group processorcircuit encompasses a processor circuit that, in combination withadditional processor circuits, executes some or all code from one ormore modules and/or controllers. References to multiple processorcircuits encompass multiple processor circuits on discrete dies,multiple processor circuits on a single die, multiple cores of a singleprocessor circuit, multiple threads of a single processor circuit, or acombination of the above. The term shared memory circuit encompasses asingle memory circuit that stores some or all code from multiple modulesand/or controllers. The term group memory circuit encompasses a memorycircuit that, in combination with additional memories, stores some orall code from one or more modules and/or controllers.

The term memory circuit is a subset of the term computer-readablemedium. The term computer-readable medium, as used herein, does notencompass transitory electrical or electromagnetic signals propagatingthrough a medium (such as on a carrier wave); the term computer-readablemedium may therefore be considered tangible and non-transitory.Non-limiting examples of a non-transitory, tangible computer-readablemedium are nonvolatile memory circuits (such as a flash memory circuit,an erasable programmable read-only memory circuit, or a mask read-onlymemory circuit), volatile memory circuits (such as a static randomaccess memory circuit or a dynamic random access memory circuit),magnetic storage media (such as an analog or digital magnetic tape or ahard disk drive), and optical storage media (such as a CD, a DVD, or aBlu-ray Disc).

The apparatuses and methods described in this application may bepartially or fully implemented by a special purpose computer created byconfiguring a general purpose computer to execute one or more particularfunctions embodied in computer programs. The functional blocks andflowchart elements described above serve as software specifications,which can be translated into the computer programs by the routine workof a skilled technician or programmer.

The computer programs include processor-executable instructions that arestored on at least one non-transitory, tangible computer-readablemedium. The computer programs may also include or rely on stored data.The computer programs may encompass a basic input/output system (BIOS)that interacts with hardware of the special purpose computer, devicedrivers that interact with particular devices of the special purposecomputer, one or more operating systems, user applications, backgroundservices, background applications, etc.

The computer programs may include: (i) descriptive text to be parsed,such as HTML (hypertext markup language) or XML (extensible markuplanguage), (ii) assembly code, (iii) object code generated from sourcecode by a compiler, (iv) source code for execution by an interpreter,(v) source code for compilation and execution by a just-in-timecompiler, etc. As examples only, source code may be written using syntaxfrom languages including C, C++, C#, Objective C, Haskell, Go, SQL, R,Lisp, Java®, Fortran, Perl, Pascal, Curl, OCaml, Javascript®, HTML5,Ada, ASP (active server pages), PHP, Scala, Eiffel, Smalltalk, Erlang,Ruby, Flash®, Visual Basic®, Lua, and Python®.

None of the elements recited in the claims are intended to be ameans-plus-function element within the meaning of 35 U.S.C. § 112(f)unless an element is expressly recited using the phrase “means for,” orin the case of a method claim using the phrases “operation for” or “stepfor.”

What is claimed is:
 1. A data access system comprising: a storagesystem, wherein the storage system includes a main memory, and a cachemodule comprising a final level of cache (FLC) controller and a cache,wherein the cache of the cache module is configured as a final level ofcache to be accessed by the FLC controller prior to the FLC controlleraccessing the main memory; and a processor coupled to one or more levelsof cache, wherein the one or more levels of cache coupled to theprocessor do not include the final level of cache, and wherein theprocessor is configured to generate, in response to data required by theprocessor not being cached in the one or more levels of cache coupled tothe processor, a physical address corresponding to a physical locationto be accessed in the storage system in order to retrieve the datarequired by the processor, the FLC controller is configured to generatea virtual address based on the physical address of the physical locationto be accessed in the storage system, wherein the virtual addresscorresponds to i) a physical location within the final level of cache,or ii) a physical location within the main memory where the datarequired by the processor is stored, and the cache module is configuredto cause, in response to determining the virtual address does notcorrespond to the physical location within the final level of cache, thedata required by the processor to be retrieved from the physicallocation within the main memory.
 2. The data access system of claim 1,wherein the causing of the data required by the processor to beretrieved from the physical location within the main memory comprisesthe cache module fetching the data from the physical location within themain memory.
 3. The data access system of claim 1, wherein the causingof the data required by the processor to be retrieved from the physicallocation within the main memory comprises the cache module indicating tothe processor that a cache miss has occurred.
 4. The data access systemof claim 1, wherein data stored in the final level of cache has higherpriority than data stored in the main memory.
 5. The data access systemof claim 1, wherein the main memory comprises a solid state drive (SSD),a hard disk drive (HDD), or a hybrid drive including solid state memoryand rotating storage media.
 6. The data access system of claim 1,wherein the cache module is configured to perform predictive fetching ofdata stored at addresses expected to be accessed in the future.
 7. Thedata access system of claim 6, wherein the predictive fetching of datacomprises the cache module, independent of receiving a request for data,accessing data stored within the main memory and transferring theretrieved data to the cache module.
 8. The data access system of claim6, wherein the predictive fetching of data comprises the cache module,independent of receiving a request for data, accessing data storedwithin the final level of cache and transferring the retrieved data tothe processor.
 9. A network comprising a first server and a secondserver, wherein: the first server comprises the cache module of claim 1;and the second server comprises the main memory of claim
 1. 10. Anautomotive vehicle comprising the data access system of claim
 1. 11. Amethod of operating a data access system, wherein the data access systemcomprises a storage system and a processor, wherein the storage systemincludes a main memory and a cache module, wherein the cache moduleincludes a final level of cache (FLC) controller and a cache, whereinthe processor is coupled to one or more levels of cache, wherein the oneor more levels of cache coupled to the processor do not include thefinal level of cache, the method comprising: configuring the cache ofthe cache module as a final level of cache to be accessed by the FLCcontroller prior to the FLC controller accessing the main memory;generating, via the processor and in response to data required by theprocessor not being cached in the one or more levels of cache coupled tothe processor, a physical address corresponding to a physical locationto be accessed in the storage system in order to retrieve the datarequired by the processor; generating a virtual address via the FLCcontroller and based on the physical address of the physical location tobe accessed in the storage system, wherein the virtual addresscorresponds to i) a physical location within the final level of cache,or ii) a physical location within the main memory where the datarequired by the processor is stored; and causing, via the cache moduleand in response to determining the virtual address does not correspondto the physical location within the final level of cache, the datarequired by the processor to be retrieved from the physical locationwithin the main memory.
 12. The method of claim 11, wherein the causingof the data required by the processor to be retrieved from the physicallocation within the main memory comprises fetching, via the cachemodule, data from the physical location within the main memory.
 13. Themethod of claim 11, wherein the causing of the data required by theprocessor to be retrieved from the physical location within the mainmemory comprises indicating, via the cache module, to the processor thata cache miss has occurred.
 14. The method of claim 11, wherein datastored in the final level of cache has higher priority than data storedin the main memory.
 15. The method of claim 11, wherein the main memorycomprises a solid state drive (SSD), a hard disk drive (HDD), or ahybrid drive including solid state memory and rotating storage media.16. The method of claim 11, further comprising performing, via the cachemodule, predictive fetching of data stored at addresses expected to beaccessed in the future.
 17. The method of claim 16, wherein thepredictive fetching of data comprises, independent of receiving arequest for data and via the cache module, accessing data stored withinthe main memory and transferring the retrieved data to the cache module.18. The method of claim 16, wherein the predictive fetching of datacomprises, independent of receiving a request for data and via the cachemodule, accessing data stored within the final level of cache andtransferring the retrieved data to the processor.
 19. The method ofclaim 11, wherein: the cache module is implemented in a first server;the main memory is implemented in a second server; and a networkcomprises the first server and the second server.